TSMC's 10,000 to 20,000 wafers were damaged by earthquakes and most of them need to be scrapped

2025-02-07 00:57:35|Myriagame |source：minecraft skins

According to Kuai Technology today (January 23), a shallow magnitude 6.4 earthquake occurred in Tai Po, Chiayi, Taiwan, China a few days ago. The earthquake affected some semiconductor factories in Tainan Science Park.

According to media reports, TSMC's Nanke fab in Tainan is estimated to be damaged by 10,000 to 20,000 wafers, most of which may require scrapping and no longer be used. This loss may be for TSMC's sales in the first quarter of 2025The amount has a low single digit percentage effect.

The wafer foundry manufacturing ranges from a wide range of products, but due to the traditional off-season demand for various parts, the average capacity utilization rate of the overall mature process is 70% to 80%, and the production line still has considerable adjustment elasticity.

In the advanced process, TrendForce consulting has determined that most of the current investment films are inventory preparations, and the impact of a short suspension or a small amount of fragmentation is easily compensated, and initial expectations will not cause any significant impact.

In addition, the earthquake also put some pressure on the panel industry in Tainan. The factory of the large panel factory Qunchuang Optoelectronics in Tainan initiated a protective automatic shutdown during the earthquake, and the damage to some machines remains to be confirmed.

Since Tainan is an important panel origin, the earthquake may further exacerbate the supply pressure on TV panels in the first quarter of 2025.

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